The Common LED Electronic Display Two Encapsulation Methods
1. DIP packaging method
DIP packaging is the abbreviation of Dualin Line-Pinpackage, commonly known as a lamp display. It was the first to be developed in the three packaging modes. The lamp beads are produced by LED lamp beads packaging manufacturers, and then the LED module and display manufacturers insert them into the LED PCB lamp board, and the DIP semi -outdoor module and outdoor waterproof modules are welded by waves. In the early stage, the three colors of traffic and blue are inserted on the PCB to form a pixel of RGB. In the later period, the three -chip of RGB can be encapsulated in a lamp bead, that is, the three -in -one outdoor full color screen, which is relatively improved. Production efficiency and production costs. However, both single lamp RGB and three -in -one RGB have spacing spacing and subject to the diameter of the lamp beads. At present, it can only be P6, and it is difficult to achieve higher -density outdoor display. The protection performance is good, but the perspective is not good and fixed, generally between 100-110, so it is suitable for large-distance display screens outdoors.
At present, the DIP display seems to be more complicated, it is not easy to implement mechanized production, and the production efficiency is underneath. The quality of the display is subject to the quality of the lamp beads of the lamp bead packaging factory. Each batch is not easy to control, so the quality is not good and controlled. In addition, there are many DIP manufacturers, without high technical and equipment thresholds, and fierce competition. Many manufacturers use poor raw materials and PCB boards to reduce costs to win market share. The quality is low, and there is almost no complete after -sales guarantee.
2. SMD packaging method
SMD packaging is the abbreviation of the Surface Mountain Devices, which means: the surface paste device, which is one of the SMT (Surface Mountt Echnology: Surface sticky technology) device. "In the initial stage of the production of electronic circuit boards, the over -hole assembly is fully completed by manual. After the first batch of automated machines are launched, they can place some simple pin elements, but complex components still need to be manually put in the peak welding. The surface paste components were launched about two decades ago, and it created a new era. From passive elements to active components and integrated circuits, they eventually become surface -stickers (SMD) Overcoming. For a long time, people think that all pin elements can eventually be packaged with SMD. SMD technology is widely used in the LED display
