Waterproof Led Advertising Sign

Products Description

LUM series - Waterproof Led Advertising Sign, designed for outdoor fixed applications, especially suitable for occasions requiring light weight, slim, easy maintenance and energy saving. It is a perfect choice for outdoor 3D LED display because it can be assembled into a giant LED screen with less weight. Shenzhen Leder is a professional supplier and manufacturer of Waterproof Led Advertising Sign in China, the products can be customized and rented.

Standby power port

The module is equipped with two power ports, one as a common port, one as a standby port, the product life is longer.

Multiple structured modules

Aluminum alloy backplane design, strong heat dissipation performance, high quality insulation adhesive, good sealing

Convenient maintenance mode

Support front and rear maintenance, central control box can be disassembled

More secure connections

The interface is directly linked, and the installation process is efficient

Led hd display screen for advertising outdoor.This product excellent performance, advanced structure, comprehensive cost-effective, can perfectly adapt to a variety of miscellaneous application scenarios, suitable for all kinds of outdoor scenes, advertising signs, roads, stations, shopping malls, landmarks and so on.

Product Picture

advertising signs

Ground screen

FAQ

LED's main packaging form classification and application

Different applications, different shapes, heat dissipation schemes, and luminous effects make LED packaging forms diverse. At present, LEDs are classified as LAMP LED, TOP LED, SIDE LED, SMD LED, High Power Led, Flip Chip LED, etc.

LAMP LED (vertical LED)

LAMP LED appeared in the early days of direct inserting LED, and its packaging was seized. The sealing process is to first inject liquid epoxy resin in the LED molding mold cavity, and then insert the pressure -welded LED bracket, put it in the oven to solidify the epoxy resin, and remove the LED from the mold cavity. Due to the relatively simple manufacturing process and low cost, it has a high market share.

SMD LED (surface sticker LED)

Patch LED is attached to the surface board surface, suitable for SMT processing, which can be welded back. It solves problems such as brightness, perspective, flatness, reliability, consistency, etc. After that, the heavier carbon steel material pins of the direct -inserted LED were removed, so that there were fewer epoxy resins that displayed the reflex layer needed to fill in, achieving the purpose of narrowing the size and reducing weight.

TOP LED (top of the top LED)

The top light -emitting LED is a relatively common patch glow diode. It is mainly used in LED lamp lamps such as bubble lamps, ceiling lamps, panel lights, solar lights.

 At present, another focus of LED packaging is the side glow package. If you want to use LED as a backlight source of LCD (LCD display), then the LED side luminescence needs to be the same as the surface, so that the LCD backlight can be uniform. Although the design of the wire rack can achieve the purpose of the side glow, the heat dissipation effect is not ideal.

  High Power LED (high -power LED)

In order to obtain high -power, high -brightness LED light sources, manufacturers develop in high -power directions in LED chips and packaging design. This packaging uses a conventional tube core high -density combination packaging. It has high luminous efficiency and low thermal resistance. It has a high light output power under large current. It is also a LED solid light source with prospective development prospects. It can be seen that the thermal characteristics of the power type LED directly affect the working temperature, lighting efficiency, and service life of LED. Therefore, the packaging design and manufacturing technology of the power -type LED chip are particularly important.

Flip Chip LED

The LED coverage packaging structure is basically a number of perforations in PCB. Each perforation on the side of the substrate is equipped with two different areas and the conductive material of each other. On the surface, there are several unpacking LED chips on each perforated place with conductive material. The positive and negative contacts of a single LED chip are connected to the conductive material on the surface of the substrate on the surface of the substrate. The surface of the number of LED chips is the surface of the perforated side of the perforation, which is covered with a transparent material. The seal is a half sphere in shape.

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